BASE MATERIAL FOR ADHERENT SHEET FOR ADHERING WAFER AND THE SHEET

PURPOSE:To suppress influence of contaminant substance and to improve reliability of a semiconductor by laminating a first constituting layer made of at least plasticizer-containing vinyl chloride series polymer and a second constituting layer made of ethylene.(meth)acrylate copolymer. CONSTITUTION:An adherent sheet 1 for adhering a wafer has a base material 1 of a laminating film having at least two constituting layers and an adhesive layer 2. At least one of the constituting layers is made of plasticizer-containing vinyl chloride series polymer (first constituting layer 1a). At least one layer except the first constituting layer 1a is formed of ethylene.(meth)acrylate copolymer (second constituting layer 1b) and is so formed as to be brought into contact with the layer 1a and disposed at the side of the layer 2. The second layer 1b is formed of ethylene.(meth)acrylate copolymer obtained by copolymerizing ethylene and acrylic acid and/or methacrylic acid, and a content of a constituent unit to be derived from the acrylic acid and/or methacrylic acid in the copolymer is 5-30wt.%.