THERMOSETTING MOLDING MATERIAL COMPOSITION
PURPOSE:To obtain a compound resin capable of providing an in-mold coated molding excellent in adhesion to a coating material, i.e., a thermosetting molding material. CONSTITUTION:This thermosetting molding material composition for carrying out the in-mold coating is composed of (a) a thermosetting...
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| creator | OKA SHIGERU UNO YOSHIAKI MAKI YOSHIKAZU |
| description | PURPOSE:To obtain a compound resin capable of providing an in-mold coated molding excellent in adhesion to a coating material, i.e., a thermosetting molding material. CONSTITUTION:This thermosetting molding material composition for carrying out the in-mold coating is composed of (a) a thermosetting resin, (b) a radical polymerization initiator, (c) a filler and (d) a curing suppressor. Any of one or more compounds selected from the group consisting of 5-20C SH group- containing compounds, alpha-methylstyrene, stilbene, 4-phenoxystyrene, cumene and 4-methyl-2,4-diphenyl-pentene-1 and monoterpenic hydrocarbons are preferred as the curing suppressor. |
| format | Patent |
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CONSTITUTION:This thermosetting molding material composition for carrying out the in-mold coating is composed of (a) a thermosetting resin, (b) a radical polymerization initiator, (c) a filler and (d) a curing suppressor. Any of one or more compounds selected from the group consisting of 5-20C SH group- containing compounds, alpha-methylstyrene, stilbene, 4-phenoxystyrene, cumene and 4-methyl-2,4-diphenyl-pentene-1 and monoterpenic hydrocarbons are preferred as the curing suppressor.</description><edition>5</edition><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>1994</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940510&DB=EPODOC&CC=JP&NR=H06128490A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940510&DB=EPODOC&CC=JP&NR=H06128490A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKA SHIGERU</creatorcontrib><creatorcontrib>UNO YOSHIAKI</creatorcontrib><creatorcontrib>MAKI YOSHIKAZU</creatorcontrib><title>THERMOSETTING MOLDING MATERIAL COMPOSITION</title><description>PURPOSE:To obtain a compound resin capable of providing an in-mold coated molding excellent in adhesion to a coating material, i.e., a thermosetting molding material. 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CONSTITUTION:This thermosetting molding material composition for carrying out the in-mold coating is composed of (a) a thermosetting resin, (b) a radical polymerization initiator, (c) a filler and (d) a curing suppressor. Any of one or more compounds selected from the group consisting of 5-20C SH group- containing compounds, alpha-methylstyrene, stilbene, 4-phenoxystyrene, cumene and 4-methyl-2,4-diphenyl-pentene-1 and monoterpenic hydrocarbons are preferred as the curing suppressor.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | THERMOSETTING MOLDING MATERIAL COMPOSITION |
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