THERMOSETTING MOLDING MATERIAL COMPOSITION

PURPOSE:To obtain a compound resin capable of providing an in-mold coated molding excellent in adhesion to a coating material, i.e., a thermosetting molding material. CONSTITUTION:This thermosetting molding material composition for carrying out the in-mold coating is composed of (a) a thermosetting...

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Bibliographische Detailangaben
Hauptverfasser:	OKA SHIGERU, UNO YOSHIAKI, MAKI YOSHIKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a compound resin capable of providing an in-mold coated molding excellent in adhesion to a coating material, i.e., a thermosetting molding material. CONSTITUTION:This thermosetting molding material composition for carrying out the in-mold coating is composed of (a) a thermosetting resin, (b) a radical polymerization initiator, (c) a filler and (d) a curing suppressor. Any of one or more compounds selected from the group consisting of 5-20C SH group- containing compounds, alpha-methylstyrene, stilbene, 4-phenoxystyrene, cumene and 4-methyl-2,4-diphenyl-pentene-1 and monoterpenic hydrocarbons are preferred as the curing suppressor.