PATTERN FORMING METHOD

PURPOSE:To easily form a coating film excellen in precision and to use various materials excellent in heat resistance and solvent resistance by irradiating a material layer with excimer laser light to form a pattern from a transfer body. CONSTITUTION:Silicone resin 2 for peeling is applied on a poly...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ISOMI AKIRA, HAGINO MASATO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To easily form a coating film excellen in precision and to use various materials excellent in heat resistance and solvent resistance by irradiating a material layer with excimer laser light to form a pattern from a transfer body. CONSTITUTION:Silicone resin 2 for peeling is applied on a polyester film supporting body 1, on which a pattern forming material layer 3 containing coloring pigment dispersed in a thermosetting resin is formed. This pattern forming material layer 3 is irradiated with excimer laser light to form a pattern. The excimer laser uses mixture gas of rare gas Xe and halogen gas Cl2. Then the pattern forming material layer 3 is transferred through an adhesive layer to a transfer substate 7 having a black matrix 8 formed on the substrate. The black matrix 8 is formed by patterning a light-shielding material such as chromium by photolithography. The adhesive layer 9 is required to have tackiness and cohesive force for peeling the pattern forming material layer from the peeling layer 2 and is preferred to the layer having high adhesion strength, heat resistance and solvent resistance after transfer.