ABS RESIN COMPOSITION HAVING IMPROVED PROCESSABILITY

PURPOSE:To provide the subject composition composed of ABS resin and a specified amount of a specified oligoamide compound blended therewith, capable of producing a molding excellent in surface properties, free from lowering of thermal deformation temperature of the resin and capable of blending vin...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TSUBOI TETSUO, TSURIGA KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	TSUBOI TETSUO TSURIGA KOJI
description	PURPOSE:To provide the subject composition composed of ABS resin and a specified amount of a specified oligoamide compound blended therewith, capable of producing a molding excellent in surface properties, free from lowering of thermal deformation temperature of the resin and capable of blending vinyl chloride resin without a danger of peeling. CONSTITUTION:An objective composition obtained by blending (A) 100 pts.wt. ABS resin with (B) 0.01-20 pts.wt. (preferably 0.05-10 pts.wt.) oligoamide compound represented by formula R1-(-CO-R3-CO-NH-R4-NH-)n-(CO-R5-NH-)n-R2 (R1 is HO-, NH2-R4-NH-, R6-NH- or R7-CO-NH-R4-NH-; R2 is -H, -CO-R7, -CO-R3- OH or -CO-R3-CO-NH-R6; R3-R5 are 1-12C alkylene; R6 and R7 are 1-18C alkyl; m and n are 0-40 and m+n=2-40) and preferably having 60-300 deg.C softening point.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH059361A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH059361A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH059361A3</originalsourceid><addsrcrecordid>eNrjZDBxdApWCHIN9vRTcPb3DfAP9gzx9PdT8HAM8_RzV_D0DQjyD3N1UQBSzq7BwY5Onj6eIZE8DKxpiTnFqbxQmptB3s01xNlDN7UgPz61uCAxOTUvtSTeK8DDwNTS2MzQ0ZiwCgBWTyck</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ABS RESIN COMPOSITION HAVING IMPROVED PROCESSABILITY</title><source>esp@cenet</source><creator>TSUBOI TETSUO ; TSURIGA KOJI</creator><creatorcontrib>TSUBOI TETSUO ; TSURIGA KOJI</creatorcontrib><description>PURPOSE:To provide the subject composition composed of ABS resin and a specified amount of a specified oligoamide compound blended therewith, capable of producing a molding excellent in surface properties, free from lowering of thermal deformation temperature of the resin and capable of blending vinyl chloride resin without a danger of peeling. CONSTITUTION:An objective composition obtained by blending (A) 100 pts.wt. ABS resin with (B) 0.01-20 pts.wt. (preferably 0.05-10 pts.wt.) oligoamide compound represented by formula R1-(-CO-R3-CO-NH-R4-NH-)n-(CO-R5-NH-)n-R2 (R1 is HO-, NH2-R4-NH-, R6-NH- or R7-CO-NH-R4-NH-; R2 is -H, -CO-R7, -CO-R3- OH or -CO-R3-CO-NH-R6; R3-R5 are 1-12C alkylene; R6 and R7 are 1-18C alkyl; m and n are 0-40 and m+n=2-40) and preferably having 60-300 deg.C softening point.</description><language>eng</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930119&DB=EPODOC&CC=JP&NR=H059361A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19930119&DB=EPODOC&CC=JP&NR=H059361A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUBOI TETSUO</creatorcontrib><creatorcontrib>TSURIGA KOJI</creatorcontrib><title>ABS RESIN COMPOSITION HAVING IMPROVED PROCESSABILITY</title><description>PURPOSE:To provide the subject composition composed of ABS resin and a specified amount of a specified oligoamide compound blended therewith, capable of producing a molding excellent in surface properties, free from lowering of thermal deformation temperature of the resin and capable of blending vinyl chloride resin without a danger of peeling. CONSTITUTION:An objective composition obtained by blending (A) 100 pts.wt. ABS resin with (B) 0.01-20 pts.wt. (preferably 0.05-10 pts.wt.) oligoamide compound represented by formula R1-(-CO-R3-CO-NH-R4-NH-)n-(CO-R5-NH-)n-R2 (R1 is HO-, NH2-R4-NH-, R6-NH- or R7-CO-NH-R4-NH-; R2 is -H, -CO-R7, -CO-R3- OH or -CO-R3-CO-NH-R6; R3-R5 are 1-12C alkylene; R6 and R7 are 1-18C alkyl; m and n are 0-40 and m+n=2-40) and preferably having 60-300 deg.C softening point.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBxdApWCHIN9vRTcPb3DfAP9gzx9PdT8HAM8_RzV_D0DQjyD3N1UQBSzq7BwY5Onj6eIZE8DKxpiTnFqbxQmptB3s01xNlDN7UgPz61uCAxOTUvtSTeK8DDwNTS2MzQ0ZiwCgBWTyck</recordid><startdate>19930119</startdate><enddate>19930119</enddate><creator>TSUBOI TETSUO</creator><creator>TSURIGA KOJI</creator><scope>EVB</scope></search><sort><creationdate>19930119</creationdate><title>ABS RESIN COMPOSITION HAVING IMPROVED PROCESSABILITY</title><author>TSUBOI TETSUO ; TSURIGA KOJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH059361A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUBOI TETSUO</creatorcontrib><creatorcontrib>TSURIGA KOJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUBOI TETSUO</au><au>TSURIGA KOJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ABS RESIN COMPOSITION HAVING IMPROVED PROCESSABILITY</title><date>1993-01-19</date><risdate>1993</risdate><abstract>PURPOSE:To provide the subject composition composed of ABS resin and a specified amount of a specified oligoamide compound blended therewith, capable of producing a molding excellent in surface properties, free from lowering of thermal deformation temperature of the resin and capable of blending vinyl chloride resin without a danger of peeling. CONSTITUTION:An objective composition obtained by blending (A) 100 pts.wt. ABS resin with (B) 0.01-20 pts.wt. (preferably 0.05-10 pts.wt.) oligoamide compound represented by formula R1-(-CO-R3-CO-NH-R4-NH-)n-(CO-R5-NH-)n-R2 (R1 is HO-, NH2-R4-NH-, R6-NH- or R7-CO-NH-R4-NH-; R2 is -H, -CO-R7, -CO-R3- OH or -CO-R3-CO-NH-R6; R3-R5 are 1-12C alkylene; R6 and R7 are 1-18C alkyl; m and n are 0-40 and m+n=2-40) and preferably having 60-300 deg.C softening point.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_JPH059361A
source	esp@cenet
subjects	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title	ABS RESIN COMPOSITION HAVING IMPROVED PROCESSABILITY
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T03%3A48%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TSUBOI%20TETSUO&rft.date=1993-01-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH059361A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true