ABS RESIN COMPOSITION HAVING IMPROVED PROCESSABILITY

PURPOSE:To provide the subject composition composed of ABS resin and a specified amount of a specified oligoamide compound blended therewith, capable of producing a molding excellent in surface properties, free from lowering of thermal deformation temperature of the resin and capable of blending vin...

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Bibliographische Detailangaben
Hauptverfasser:	TSUBOI TETSUO, TSURIGA KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide the subject composition composed of ABS resin and a specified amount of a specified oligoamide compound blended therewith, capable of producing a molding excellent in surface properties, free from lowering of thermal deformation temperature of the resin and capable of blending vinyl chloride resin without a danger of peeling. CONSTITUTION:An objective composition obtained by blending (A) 100 pts.wt. ABS resin with (B) 0.01-20 pts.wt. (preferably 0.05-10 pts.wt.) oligoamide compound represented by formula R1-(-CO-R3-CO-NH-R4-NH-)n-(CO-R5-NH-)n-R2 (R1 is HO-, NH2-R4-NH-, R6-NH- or R7-CO-NH-R4-NH-; R2 is -H, -CO-R7, -CO-R3- OH or -CO-R3-CO-NH-R6; R3-R5 are 1-12C alkylene; R6 and R7 are 1-18C alkyl; m and n are 0-40 and m+n=2-40) and preferably having 60-300 deg.C softening point.