ONE-COMPONENT EPOXY RESIN COMPOSITION

PURPOSE:To provide the title compsn. which is curable both at room temp. and elevated temp. and suitable for an adhesive and a sealant. CONSTITUTION:The title compsn. comprises 100 pts.wt. epoxy resin, 1-30 pts.wt. ketimine which is a curative for a moisture-curing epoxy resin, 1-40 pts.wt. latent c...

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Bibliographische Detailangaben
1. Verfasser:	SHIN NORIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE:To provide the title compsn. which is curable both at room temp. and elevated temp. and suitable for an adhesive and a sealant. CONSTITUTION:The title compsn. comprises 100 pts.wt. epoxy resin, 1-30 pts.wt. ketimine which is a curative for a moisture-curing epoxy resin, 1-40 pts.wt. latent curative which acts as a curative for an epoxy resin at 70 deg.C or higher, 5-1,000 pts.wt. silane compd., and a catalyst for the silane compd. in an ant. of 0.1-10 pts.wt. based on 100 pts.wt. the silane compd.