MULTILAYERED PRINTED WIRING BOARD

PURPOSE:To obtain a multilayered printed wiring board provided with a through-hole the wall surface of which is not damaged by the pre-processing for plating the through hole. CONSTITUTION:In this multilayered printed wiring board which is constituted by putting an internal-layer material 1 on which...

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Hauptverfasser: OKUYAMA KATSUO, URAKUCHI YOSHINORI
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creator OKUYAMA KATSUO
URAKUCHI YOSHINORI
description PURPOSE:To obtain a multilayered printed wiring board provided with a through-hole the wall surface of which is not damaged by the pre-processing for plating the through hole. CONSTITUTION:In this multilayered printed wiring board which is constituted by putting an internal-layer material 1 on which a conductive circuit 2 is formed between external-layer substrates 3 respectively provided with conductive circuits 4 on their surfaces, lands 5 which are connected to the conductive circuits 2 and lands 7 which are not connected to the conductive circuits 2 are formed on both surfaces of the material 1 where a through-hole 8 is formed.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title MULTILAYERED PRINTED WIRING BOARD
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