MULTILAYERED PRINTED WIRING BOARD

PURPOSE:To obtain a multilayered printed wiring board provided with a through-hole the wall surface of which is not damaged by the pre-processing for plating the through hole. CONSTITUTION:In this multilayered printed wiring board which is constituted by putting an internal-layer material 1 on which...

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Bibliographische Detailangaben
Hauptverfasser:	OKUYAMA KATSUO, URAKUCHI YOSHINORI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a multilayered printed wiring board provided with a through-hole the wall surface of which is not damaged by the pre-processing for plating the through hole. CONSTITUTION:In this multilayered printed wiring board which is constituted by putting an internal-layer material 1 on which a conductive circuit 2 is formed between external-layer substrates 3 respectively provided with conductive circuits 4 on their surfaces, lands 5 which are connected to the conductive circuits 2 and lands 7 which are not connected to the conductive circuits 2 are formed on both surfaces of the material 1 where a through-hole 8 is formed.