SEMICONDUCTOR DEVICE SEALED WITH RESIN

SEMICONDUCTOR DEVICE SEALED WITH RESIN

PURPOSE:To eliminate the occurrence of cracks by applying a processing agent which lowers the adhesion with a resin material, which constitutes a package, to the lead part being led out of the package from the stage of a lead frame. CONSTITUTION:A processing agent 10 which lowers the adhesion with a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KITASAKO HIROYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To eliminate the occurrence of cracks by applying a processing agent which lowers the adhesion with a resin material, which constitutes a package, to the lead part being led out of the package from the stage of a lead frame. CONSTITUTION:A processing agent 10 which lowers the adhesion with a resin material, which constitutes a package, is applied to the lead part 8 being led out of the package from the stage 1 of a lead frame. Therefore, the moisture, which has penetrated into the stage 1, can escape without exerting stress to the periphery of the stage 1 in solder mounting. Thus, the occurrence of the package cracks an be prevented effectively.