ALIGNMENT TRANSFER METHOD

PURPOSE:To perform a transfer operation which is suitable for manufacturing a thin- film semiconductor element by a method wherein, before a flat board for pattern transfer use is brought into close contact with a flat board to be transferred, the positional relationship between both is observed opt...

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Bibliographische Detailangaben
Hauptverfasser:	ASAKA KENJI, TAKEUCHI SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY COLOUR PRINTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS PRINTING PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES SEMICONDUCTOR DEVICES STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	PURPOSE:To perform a transfer operation which is suitable for manufacturing a thin- film semiconductor element by a method wherein, before a flat board for pattern transfer use is brought into close contact with a flat board to be transferred, the positional relationship between both is observed optically, one of them is moved to a prescribed position and an alignment operation is executed. CONSTITUTION:A flat board 1 for pattern transfer use and a flat board 2 to be transferred which are faced by keeping a matching gap H are aligned while the positional relationship between a register mark, on the pattern side, which has been formed on the flat board 1 for pattern transfer use and a register mark, on the work side, which has been formed on the flat board 2 to be transferred is being observed optically by means of observation optical systems 20 in a state that the matching gap H has been maintained. At least one out of the flat board 1 for pattern transfer use and the flat board 2 to be transferred is moved up to a position where the register mark on the pattern side and the register mark on the work side are observed in a prescribed relationship according to information obtained from the observation optical systems 20, and they are aligned. Thereby, the close contact strength of both flat boards and its uniformity can be enhanced.