RESIN SEALING TYPE SEMICONDUCTOR DEVICE

PURPOSE:To improve an yield of a product while improving mounting density. CONSTITUTION:Outer leads 331 to 334 for power supply are provided on one side of a resin-made package 31 and on both end parts in the longitudinal direction. A plurality of outer leads 341 to 34n as signal input/output terminals are arranged in a resin-made package 31 located between these outer leads 332 and 333 mutually. Through holes 361 to 364 into which these outer leads 331 to 334 are to be inserted are provided on a printed board 35. In this way, the package 31 is positioned by the outer leads 331 to 334 for power supply so that mounting density can be improved without requiring a special projection or the like. Moreover, since the outer leads 331 to 334 for power supply are metal-made, they are hard to be broken so as to improve an yield.