WIRE BONDING METHOD AND WIRE BONDING DEVICE

PURPOSE:To provide a wire bonding method and a wire boding device which can shorten the bonding time and besides can materialize the stable bonding by making it hard to cause the dislocation of the second bonding part. CONSTITUTION:First bonding is performed by forming a molten ball 9a at the top of...

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Bibliographische Detailangaben
1. Verfasser:	KOZUKA TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a wire bonding method and a wire boding device which can shorten the bonding time and besides can materialize the stable bonding by making it hard to cause the dislocation of the second bonding part. CONSTITUTION:First bonding is performed by forming a molten ball 9a at the top of a wire 5, and then a molten ball 9a is formed again at the specified position in the middle of the wire 5, and the second bonding is performed with the molten ball 9a made at the specified section.