MANUFACTURE OF PRINTED CIRCUIT BOARD

PURPOSE:To obtain a printed circuit board on which electronic components, such as ICs, etc., can be mounted in a state where the parts are highly reliably connected to the printed circuit board by wire bonding. CONSTITUTION:After a palladium-plated pattern 7 is formed on the surface of a prefixed circuit pattern forming area on a copper-clad laminated substrate 1, a circuit pattern is formed by selectively etching semiconductors 4 and 5 by using the pattern 7 as an etching mask. It is preferable to use nickel or a nickel alloy as the base for the palladium plate 7. It is further preferable to expose bonding sections 3, with the other sections coated with a solder resist, and improve the bonding property of the sections 3 by performing surface cleaning treatment, such as solvent treatment, pickling, etc., on the sections 3. Since the palladium plate is about 50% less expensive in material cost as compared with gold plates and can be used as a mask at the time of forming the circuit pattern, a highly reliable printed board can be manufactured through a simple process.