TAPE CARRIER FOR TAB

PURPOSE:To obtain a tape carrier for TAB where formation of an intermetallic compound of Cu and Sn is suppressed to prevent the break of an inner lead, by providing Sn or Sn-Pb plating, which contains Zn, on the surface of a copper pattern lead. CONSTITUTION:On a copper pattern lead 11 excluding, at least, the inner lead, an Sn or Sn-Pb plated layer 30 which contains Zn is made. This way, by applying Sn or Sn-Pb plating, which contains Zn, the formation of the hard intermetallic compound produced by the reaction between Cu and Sn can be prevented, so the break of the inner lead and the wire breaking by corrosion under corrosive environment can be prevented. Therefore, when making high- class precision machines, it becomes possible to mass-produce them, using tape carriers for TAB.