POLYAMIDE RESIN COMPOSITION

PURPOSE:To provide a polyamide composition remarkably improved in the effect of preventing gelation of polymethyleneadipamide during polymerization and molding. CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide and a compound of general formula ZCH2Z [I] or ZCHRZ [II] [wh...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KITAMURA KAZUYUKI, MORITA KIMIHIRO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE:To provide a polyamide composition remarkably improved in the effect of preventing gelation of polymethyleneadipamide during polymerization and molding. CONSTITUTION:A polyamide composition which consists of polymethyleneadipamide and a compound of general formula ZCH2Z [I] or ZCHRZ [II] [wherein Z and Z are each R0, CHO, COR1, CO2R2, CN, NO2, SOR3, SO2R4 or SO3R5 (wherein R0 is allyl; R1 to R5 are each a straight-chain or unsaturated cyclic compound, i.e., allyl, alkyl or aralkyl)]. Examples of the compounds of formulas I and II include indene, fluorene, 2-methylpyridine and diphenylmethane, which are added before polymerization or molding. They exhibit a remarkable effect of preventing gelation and cause very little foaming of the polymer.