METHOD AND APPARATUS FOR INSPECTING CASSETTE FOR SEMICONDUCTOR WAFER, AND CLEANING DEVICE FOR THE CASSETTE

METHOD AND APPARATUS FOR INSPECTING CASSETTE FOR SEMICONDUCTOR WAFER, AND CLEANING DEVICE FOR THE CASSETTE

PURPOSE:To prevent a problem, an accident to occur when a defective cassette is used by deciding propriety of a shape of a groove for containing a semiconductor wafer of a cassette for the wafer. CONSTITUTION:A contact sensing plate 3 having the same shape and size as those of a semiconductor wafer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: OGURA TAKEISA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To prevent a problem, an accident to occur when a defective cassette is used by deciding propriety of a shape of a groove for containing a semiconductor wafer of a cassette for the wafer. CONSTITUTION:A contact sensing plate 3 having the same shape and size as those of a semiconductor wafer to be contained in a groove 5 of a cassette 4 is inserted into the groove 5, and propriety of the shape of the groove 5 is decided based on presence or absence of a resistance force in the case of insertion. Or, the groove 5 is irradiated with a light beam, and the propriety of the shape of the groove 5 is decided in a noncontact manner based on an attenuated amount of the beam when the beam is passed through the groove 5.