METHOD FOR FORMATION OF PHOTORESIST

PURPOSE:To provide a forming method of a photoresist which enables good patterning of a metal thin film. CONSTITUTION:A metal thin film formed on a substrate is coated with a photoresist and then patterned. In this process, the metal thin film on the substrate is first heat treated and then coated w...

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE HIROSHI, DANJIYOU KATSUSHI, MITSUI MUTSUO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a forming method of a photoresist which enables good patterning of a metal thin film. CONSTITUTION:A metal thin film formed on a substrate is coated with a photoresist and then patterned. In this process, the metal thin film on the substrate is first heat treated and then coated with the photoresist. The metal thin film is preferably heat treated at >=200 deg.C.