HEAT-RESISTANT RESIN COMPOSITION

PURPOSE:To obtain a heat-resistant resin composition improved in glass transition temperature, storage stability and workability by mixing a specified resin composition with a polyamine and curing the mixture by heating. CONSTITUTION:A resin composition (A) is obtained by mixing 100 pts.wt. polymale...

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Bibliographische Detailangaben
Hauptverfasser:	OKITSU TOSHINAO, SATO SHINICHI, NOJIRI HISAO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a heat-resistant resin composition improved in glass transition temperature, storage stability and workability by mixing a specified resin composition with a polyamine and curing the mixture by heating. CONSTITUTION:A resin composition (A) is obtained by mixing 100 pts.wt. polymaleimide resin of the formula (wherein R1 is an n-valent organic group; Xa and Xb are each H or a monovalent organic group; and n is 2-4) with 10-300 pts.wt. epoxy resin having at least two epoxy groups in the molecule and 10-50 pts.wt. compound having one-OH group and one acetylene group in the molecule at 80-200 deg.C for 5-24hr. 100 pts.wt. component A is mixed with 3-100 pts.wt. polyamine at 80-250 deg.C for 1-48hr, and the mixture is cured by heating.