COMPOSITE BODY AND USE THEREFOR

PURPOSE:To enhance the adhesive of a copper foil with a prepreg in a circuit board, in which the prepreg, in which a cloth-shaped base material is impregnated with a fluororesin, and the copper foil are bonded. CONSTITUTION:A composite body, in which the non-baked thin layer of a fluororesin is form...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ERIGUCHI FUYUKI, MOTOGAMI MITSURU, SHIBAGAKI KAZUYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To enhance the adhesive of a copper foil with a prepreg in a circuit board, in which the prepreg, in which a cloth-shaped base material is impregnated with a fluororesin, and the copper foil are bonded. CONSTITUTION:A composite body, in which the non-baked thin layer of a fluororesin is formed onto the mat surface of a copper foil, is prepared, and the fluororesin non-baked thin layers of said composite body are superposed on both surfaces of a fluororesin prepreg so as to be faced oppositely, and heated and pressed and unified.