JPH05345433
PURPOSE:To provide a thermal head of high efficiency and superior response properties and with little generation of cracks. CONSTITUTION:The thickness of a substrate film 3 or a protective film 7 constituting a thermal head is so formed that the Knoop hardness over the protective film 7 is 1200kgf/m...
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| creator | HONMA KATSUHISA YANAGIBASHI KATSUMI |
| description | PURPOSE:To provide a thermal head of high efficiency and superior response properties and with little generation of cracks. CONSTITUTION:The thickness of a substrate film 3 or a protective film 7 constituting a thermal head is so formed that the Knoop hardness over the protective film 7 is 1200kgf/mm or more when the same is measured at the load of 20g. The substrate film 3 and the protective film 7 are formed by sputtering a ceramic material of either N or C, and Si as main components, and the total of respective thickness of the substrate film 3 and that of the protective film 7 is 6mum or more. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH05345433A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH05345433A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH05345433A3</originalsourceid><addsrcrecordid>eNrjZOD2CvAwMDU2MTUxNuZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFIOhyNiVEDADz_G6c</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>JPH05345433</title><source>esp@cenet</source><creator>HONMA KATSUHISA ; YANAGIBASHI KATSUMI</creator><creatorcontrib>HONMA KATSUHISA ; YANAGIBASHI KATSUMI</creatorcontrib><description>PURPOSE:To provide a thermal head of high efficiency and superior response properties and with little generation of cracks. CONSTITUTION:The thickness of a substrate film 3 or a protective film 7 constituting a thermal head is so formed that the Knoop hardness over the protective film 7 is 1200kgf/mm or more when the same is measured at the load of 20g. The substrate film 3 and the protective film 7 are formed by sputtering a ceramic material of either N or C, and Si as main components, and the total of respective thickness of the substrate film 3 and that of the protective film 7 is 6mum or more.</description><edition>5</edition><language>eng</language><subject>CORRECTION OF TYPOGRAPHICAL ERRORS ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINING MACHINES ; PERFORMING OPERATIONS ; PRINTING ; SELECTIVE PRINTING MECHANISMS ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>1993</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19931227&DB=EPODOC&CC=JP&NR=H05345433A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19931227&DB=EPODOC&CC=JP&NR=H05345433A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HONMA KATSUHISA</creatorcontrib><creatorcontrib>YANAGIBASHI KATSUMI</creatorcontrib><title>JPH05345433</title><description>PURPOSE:To provide a thermal head of high efficiency and superior response properties and with little generation of cracks. CONSTITUTION:The thickness of a substrate film 3 or a protective film 7 constituting a thermal head is so formed that the Knoop hardness over the protective film 7 is 1200kgf/mm or more when the same is measured at the load of 20g. The substrate film 3 and the protective film 7 are formed by sputtering a ceramic material of either N or C, and Si as main components, and the total of respective thickness of the substrate film 3 and that of the protective film 7 is 6mum or more.</description><subject>CORRECTION OF TYPOGRAPHICAL ERRORS</subject><subject>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</subject><subject>LINING MACHINES</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTING</subject><subject>SELECTIVE PRINTING MECHANISMS</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1993</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOD2CvAwMDU2MTUxNuZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFIOhyNiVEDADz_G6c</recordid><startdate>19931227</startdate><enddate>19931227</enddate><creator>HONMA KATSUHISA</creator><creator>YANAGIBASHI KATSUMI</creator><scope>EVB</scope></search><sort><creationdate>19931227</creationdate><title>JPH05345433</title><author>HONMA KATSUHISA ; YANAGIBASHI KATSUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH05345433A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1993</creationdate><topic>CORRECTION OF TYPOGRAPHICAL ERRORS</topic><topic>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</topic><topic>LINING MACHINES</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTING</topic><topic>SELECTIVE PRINTING MECHANISMS</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>HONMA KATSUHISA</creatorcontrib><creatorcontrib>YANAGIBASHI KATSUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HONMA KATSUHISA</au><au>YANAGIBASHI KATSUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>JPH05345433</title><date>1993-12-27</date><risdate>1993</risdate><abstract>PURPOSE:To provide a thermal head of high efficiency and superior response properties and with little generation of cracks. CONSTITUTION:The thickness of a substrate film 3 or a protective film 7 constituting a thermal head is so formed that the Knoop hardness over the protective film 7 is 1200kgf/mm or more when the same is measured at the load of 20g. The substrate film 3 and the protective film 7 are formed by sputtering a ceramic material of either N or C, and Si as main components, and the total of respective thickness of the substrate film 3 and that of the protective film 7 is 6mum or more.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_JPH05345433A |
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| subjects | CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS |
| title | JPH05345433 |
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