JPH05345433

PURPOSE:To provide a thermal head of high efficiency and superior response properties and with little generation of cracks. CONSTITUTION:The thickness of a substrate film 3 or a protective film 7 constituting a thermal head is so formed that the Knoop hardness over the protective film 7 is 1200kgf/m...

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Bibliographische Detailangaben
Hauptverfasser:	HONMA KATSUHISA, YANAGIBASHI KATSUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a thermal head of high efficiency and superior response properties and with little generation of cracks. CONSTITUTION:The thickness of a substrate film 3 or a protective film 7 constituting a thermal head is so formed that the Knoop hardness over the protective film 7 is 1200kgf/mm or more when the same is measured at the load of 20g. The substrate film 3 and the protective film 7 are formed by sputtering a ceramic material of either N or C, and Si as main components, and the total of respective thickness of the substrate film 3 and that of the protective film 7 is 6mum or more.