JPH05344693
PURPOSE:To provide a method for fixing a printed wiring board which ensures a fixing strength of a printed wiring board and sufficient safety for moisture and water and is sufficiently resistive to an external force due to fluid pressure of mold resin. CONSTITUTION:A printed wiring board 4 is held b...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To provide a method for fixing a printed wiring board which ensures a fixing strength of a printed wiring board and sufficient safety for moisture and water and is sufficiently resistive to an external force due to fluid pressure of mold resin. CONSTITUTION:A printed wiring board 4 is held by a fixing board 3 for the purpose of fixing. Moreover, since the projected portion 3a of the fixing board 3 has a shape to be matched with the recessed portion 9a at the central end face of a lower die 9, when both the upper die 9 and lower die 9 are tightened, these are simultaneously positioned securely within the mold metal and the fixing board 3 is held for fixing by a fixing board holding pin 8a of the upper die 8 and the recessed portion 9 at the central end surface of the lower die 9. |
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