JPH05344693

PURPOSE:To provide a method for fixing a printed wiring board which ensures a fixing strength of a printed wiring board and sufficient safety for moisture and water and is sufficiently resistive to an external force due to fluid pressure of mold resin. CONSTITUTION:A printed wiring board 4 is held b...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KONDO MOTOTERU
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE:To provide a method for fixing a printed wiring board which ensures a fixing strength of a printed wiring board and sufficient safety for moisture and water and is sufficiently resistive to an external force due to fluid pressure of mold resin. CONSTITUTION:A printed wiring board 4 is held by a fixing board 3 for the purpose of fixing. Moreover, since the projected portion 3a of the fixing board 3 has a shape to be matched with the recessed portion 9a at the central end face of a lower die 9, when both the upper die 9 and lower die 9 are tightened, these are simultaneously positioned securely within the mold metal and the fixing board 3 is held for fixing by a fixing board holding pin 8a of the upper die 8 and the recessed portion 9 at the central end surface of the lower die 9.