JPH05343599

PURPOSE:To obtain a surface mounting type IC in which a probe of a testing unit can be easily connected to a lead terminal in a state that the IC is mounted on a printed board, an accurate measurement is conducted and a circuit damage can be prevented. CONSTITUTION:A second leg piece 20c at an end o...

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Bibliographische Detailangaben
1. Verfasser:	HIKITA TAKEO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a surface mounting type IC in which a probe of a testing unit can be easily connected to a lead terminal in a state that the IC is mounted on a printed board, an accurate measurement is conducted and a circuit damage can be prevented. CONSTITUTION:A second leg piece 20c at an end of a lead terminal 20 of a surface mounting type IC 1X is vertically erected on a printed board, and extended substantially to a surface position of a semiconductor package body 1. Further, adjacent second leg pieces are so formed that angles of the adjacent pieces are different. A seat part is provided at the end side of the second piece.