JPH05335748

PURPOSE:To facilitate the manufacture of a multilayer circuit board having a thick-film resistor while the density of surface interconnections is increased. CONSTITUTION:A multilayer circuit board 1 is provided with: a board body 2 made of integrated sheets 2a... 2h that are obtained by laminating a number of ceramic green sheets and calcining the sheets in an integrated fashion; an inner interconnection layer 3 formed within the board body 2 and made of silverbased materials; a surface interconnection 4 formed on the main surface of the board body 2 and connected to the inner interconnection layer 3 and made of copper-based materials that can be calcined at temperatures under the eutectic point of silver and copper; and a thick-film resistor 5 formed on the main surface of the board body 2 and connected to the surface interconnection 4. The thick-film resistor 5 consists of a resistor material that can be calcined under the eutectic point of silver and copper and in a non-oxidizing atmosphere.