JPH05335700

PURPOSE:To manufacture a composite wiring board having excellent heat radiating property, strength, and workability by opening parts required for radiating heat in a resin-base wiring board and filling the opened parts with an inorganic material, and then, integrating the inorganic material. CONSTITUTION:A phenolic resin, cresylic resin, etc., or their modified products or mixtures can be used for forming the resin base of the title wiring board. Inorganic fibers of glass or asbestos, organic fibers of polyester or polyamide, etc., can be used as the base material of the substrate. A resin-base wiring board is obtained by using a prescribed number of resin-impregnated base material sheets manufactured by impregnating the base material with a resin and metallic foil of copper, aluminum, etc. The resin-base wiring board also includes a multilayered printed wiring board obtained by working a substrate. The title composite wiring board is obtained by filling the openings of the parts required for radiating heat with aluminum, iron, alumina, etc., and integrating the filler. Therefore, the heat radiating property of the composite wiring board can be improved without deteriorating its strength and workability.