JPH05335698

PURPOSE:To improve the lead parts mounting efficiency of the title substrate by forming a planned lead wire pattern in a planned lead wire section and on the surface of a metallic plate with openings by aligning the pattern with the openings after integrally positioning metallic foil on the surface...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: MURAKAMI HISAO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE:To improve the lead parts mounting efficiency of the title substrate by forming a planned lead wire pattern in a planned lead wire section and on the surface of a metallic plate with openings by aligning the pattern with the openings after integrally positioning metallic foil on the surface of the metallic plate with a resin layer in between. CONSTITUTION:Aluminum, iron, etc., their alloys, or their composite materials can be used for the metallic plate of the title substrate. The activity and interlayer adhesion of the surface of the metallic plate can be improved through a physical or chemical process, but it is necessary to open planned lead wire sections in advance. It is preferable to use a phenolic or cresylic resin for the resin layer of the title substrate. In addition, copper or aluminum foil having a thickness of 0.018-0.07mm is used for the metallic foil of the substrate and presses, rolls, etc., can be used as an integrating means when the means can unite the plate, layer, and foil in one body. After integration, the title metallic- base wiring board is obtained by forming a lead-wire position pattern by aligning the pattern with the openings. As a result, the lead parts mounting efficiency of the wiring board can be improved.