JPH05335414

PURPOSE:To reduce cost in the case of manufacturing many kinds of articles of small amount, and enable high density integration, by mounting various parts circuits on a monolithic IC, and electrically connecting the parts circuit by bonding in response to desired circuit function and the like. CONSTITUTION:For example, the circuit surrouned by a broken line in figure is a low-pass filter, and resistors R1-R4 are, wired as shown by figure. The resistors R1-R4 are built in a monolithic IC, and wired by bonding when the low-pass filter is necessary. Monolithic IC's are not designed and manufactured for filters having specified characteristics, but various parts circuits are previously built in the monolithic IC in order that filter characteristics may be variously changed by bonding. Thereby low cost products can be supplied in the case of manufacturing many kinds of articles of small amount.