ELECTROLESS PLATING METHOD

PURPOSE:To obtain a stabilized-quality plating film over a long period by this electroless plating method with the amt. of waste liq. reduced. CONSTITUTION:A material to be treated is electroless-plated in a tank 1 filled with an electroless plating soln., and the plated material is cleaned with wat...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIZAWA IZURU, YAMAGUCHI NOBORU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a stabilized-quality plating film over a long period by this electroless plating method with the amt. of waste liq. reduced. CONSTITUTION:A material to be treated is electroless-plated in a tank 1 filled with an electroless plating soln., and the plated material is cleaned with water. In this case, a fresh plating soln. is successively supplied to the tank 1, the excess plating soln. overflowing the tank 1 as the fresh soln. is supplied is mixed with the waste water generated by the cleaning, a liq. contg. valuable components is recovered from the liq. mixture by electrodialysis, the recovered liq. is supplied to the tank 1, and at least one among the excess plating soln., liq. mixture and recovered liq. is treated with activated carbon.