BONDER AND BONDING METHOD FOR TAB FILM CARRIER

PURPOSE:To enhance reliability of bond, to prevent lowering of yield due to thermal damage, and to enhance work efficiency (operational efficiency of bonder) in a work for bonding the inner lead part of a TAB film carrier to the electrode parts of an IN chip. CONSTITUTION:An IC bonding head 1 is low...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OTADA MASAMI, WATABE SHINOBU, MATSUI EITARO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!