BONDER AND BONDING METHOD FOR TAB FILM CARRIER

BONDER AND BONDING METHOD FOR TAB FILM CARRIER

PURPOSE:To enhance reliability of bond, to prevent lowering of yield due to thermal damage, and to enhance work efficiency (operational efficiency of bonder) in a work for bonding the inner lead part of a TAB film carrier to the electrode parts of an IN chip. CONSTITUTION:An IC bonding head 1 is low...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OTADA MASAMI, WATABE SHINOBU, MATSUI EITARO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To enhance reliability of bond, to prevent lowering of yield due to thermal damage, and to enhance work efficiency (operational efficiency of bonder) in a work for bonding the inner lead part of a TAB film carrier to the electrode parts of an IN chip. CONSTITUTION:An IC bonding head 1 is lowered relatively to a film carrier 30 supported on a carrier table 10 so that an IC chip 20, suction held by the head 1, is brought into pressure contact with the film carrier 30. Furthermore, ultrasonic lateral vibration is applied from an ultrasonic horn onto the IC chip 20 so that bumps 21 are fused with resistive heat.