SEMICONDUCTOR DEVICE

PURPOSE:To improve the heat radiation property and reliability while promoting thinning, concerning a semiconductor device which has a heat radiation member. CONSTITUTION:A semiconductor device is provided, which is equipped with a package 21 consisting of an upper body 21 a and a lower body 21b and...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YONEDA YOSHIYUKI, TANIGUCHI TETSUO, TSUJI KAZUTO, SAIGO YUKIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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