SEMICONDUCTOR DEVICE

PURPOSE:To improve the heat radiation property and reliability while promoting thinning, concerning a semiconductor device which has a heat radiation member. CONSTITUTION:A semiconductor device is provided, which is equipped with a package 21 consisting of an upper body 21 a and a lower body 21b and sealing a semiconductor chip therein, a lead 25 electrically connected to this semiconductor chip and also extended out of the package 21, and a heat radiating member 22 radiating heat generated in the semiconductor chip. It is constituted such that a heat radiating member 22 is installed on the package 21 by making the size of an upper body 21a smaller than that of a lower body 21b, and forming an insertion hole 30 corresponding to the shape of the upper body 21a, in the heat radiating member 22, and setting the heat radiating member 22 around the upper body 21a.