EXPOSURE MASK AND MULTI-LAYER SUBSTRATE MANUFACTURED BY USING THE SAME

PURPOSE:To provide cost reduction for an exposure mask on which metal films different in thickness are formed and a multi-layer substrate manufactured by using the exposure mask in steps of exposing and developing an insulation layer and laminating a conductive pattern on the patterned portion forme...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	OZAKI TOKUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide cost reduction for an exposure mask on which metal films different in thickness are formed and a multi-layer substrate manufactured by using the exposure mask in steps of exposing and developing an insulation layer and laminating a conductive pattern on the patterned portion formed by development, by cutting down manufacturing steps for the multi-layer substrate. CONSTITUTION:A shading pattern 4 which consists of the first metal film 2 of predetermined thickness and the second metal film 3 different in thickness from the first metal film 2 laminated in place on the first metal film 2 is provided on a transparent glass base material 1 to form an exposure mask. The exposure mask is overlaid on an light-sensitive polyimide insulation layer 11 laminated on a substrate 10 for exposure and development to provide the insulation layer 11 with the patterned portion 13A as the recessed portion and a penetrated portion 13B where the insulation layer 11 is completely removed, at the same time. Conductive material is laminated on the patterned portion 13A and the penetrated portion 3B to form a conductive pattern 12 by which a multi-layer substrate is completed.