PRETREATMENT FOR ELECTROPLATING

PURPOSE:To improve adhesion property of a plating layer to be formed and to prevent degradation of characteristics of the film in a pretreatment of Al metal base body by dipping the base body in an aq. soln. in which the amt. of fluorine ion, etc., pH and liquid temp. are specified. CONSTITUTION:Whe...

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Hauptverfasser:	IKEDA TSUGUMOTO, UEDA TOSHIKI, TAKEE NAGISA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PURPOSE:To improve adhesion property of a plating layer to be formed and to prevent degradation of characteristics of the film in a pretreatment of Al metal base body by dipping the base body in an aq. soln. in which the amt. of fluorine ion, etc., pH and liquid temp. are specified. CONSTITUTION:When a base body of Al or Al alloy is subjected to pretreatment for electroplating, the base body is dipped in an aq. soln. having 0.1-1mol/l fluorine ion or fluoride ions, pH