I/F SUBSTRATE

I/F SUBSTRATE

PURPOSE:To obtain an I/F substrate commonly applicable to both a surface system and a rear system. CONSTITUTION:Ground reinforcement patterns 1a, 1b are formed around through holes 5a, 5b, so as to be isolated from a ground surface 3. A foot pattern 9a of an IC socket 8a for a surface system which f...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SAKAI IWAO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Beschreibung
Zusammenfassung:PURPOSE:To obtain an I/F substrate commonly applicable to both a surface system and a rear system. CONSTITUTION:Ground reinforcement patterns 1a, 1b are formed around through holes 5a, 5b, so as to be isolated from a ground surface 3. A foot pattern 9a of an IC socket 8a for a surface system which foot pattern 9a is to be connected with a ground pin 7 of an IC is inserted into the through hole 5a. A foot pattern 9b of an IC socket 8b for a rear system which foot pattern 9b is to be connected with a ground pin 7 of the IC is inserted into the through hole 5b.