PLASMA CVD APPARATUS

PURPOSE:To improve productivity of a plasma CVD apparatus by reducing the number of times of maintenances of a light transmission part provided in a reaction chamber. CONSTITUTION:The plasma CVD apparatus comprises a cylindrical spacer 28 made of an insulating material to surround a periphery of a s...

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Bibliographische Detailangaben
Hauptverfasser:	HOUCHIN RIYUUZOU, SUZUKI NAOKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To improve productivity of a plasma CVD apparatus by reducing the number of times of maintenances of a light transmission part provided in a reaction chamber. CONSTITUTION:The plasma CVD apparatus comprises a cylindrical spacer 28 made of an insulating material to surround a periphery of a space between a substrate base 23 and a quartz plate 26 of a light transmission part, a purge gas supply port 27 for supplying nitrogen, oxygen or inert gas into the spacer 28, and a purge gas discharge port 29 for discharging the supplied purge gas into a reaction chamber 15. Thus, heat transfer from the base 23 to the chamber 15 is reduced without disturbing emitting of an infrared ray from an infrared lamp 25 to the base 23 through the transmission part. The N2 gas, O2 gas or inert gas is supplied into the spacer 28, discharged from the port 29 to eliminate mixture of the reaction gas into the spacer 29, thereby obviating deposition of a film on the plate 26.