JPH05311498

PURPOSE:To save equipment cost by reducing the number of pumps in a device for supplying plating solution to plating cell. CONSTITUTION:In the device for supplying plating solution in electroplating line to supply a plating solution to a plurality of the plating cells 3 from a plating solution recyc...

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Bibliographische Detailangaben

Hauptverfasser:	IMAIZUMI HIDEHIKO, MOCHIDA MASARU, MARUYAMA KATSUTOSHI, TSUYUKI AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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