JPH05311498

JPH05311498

PURPOSE:To save equipment cost by reducing the number of pumps in a device for supplying plating solution to plating cell. CONSTITUTION:In the device for supplying plating solution in electroplating line to supply a plating solution to a plurality of the plating cells 3 from a plating solution recyc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IMAIZUMI HIDEHIKO, MOCHIDA MASARU, MARUYAMA KATSUTOSHI, TSUYUKI AKIRA
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:PURPOSE:To save equipment cost by reducing the number of pumps in a device for supplying plating solution to plating cell. CONSTITUTION:In the device for supplying plating solution in electroplating line to supply a plating solution to a plurality of the plating cells 3 from a plating solution recycle tank 1, branched pipes 6 to supply the plating solution to each of the plating cells 3 communicate with a collecting pipe 5, the collecting pipe 5 communicates with the plating solution recycle tank 1, a large capacity pump 4 is provided in the collecting pipe 5 and each of the branched pipes 6 is provided respectively with a flow meter 7 and a valve 8 for adjusting flow rate.