JPH05311141

PURPOSE:To provide the adhesive containing an epoxy resin, a specific ketimine, a modified silicone resin and a catalyst for the resin, curable at normal temperature in spite of one-pack type composition, having excellent storage stability and giving a cured material having excellent elasticity. CON...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUGITA HIROSHI, KANEMURA ATSUSHI, WAKAHARA NAOKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To provide the adhesive containing an epoxy resin, a specific ketimine, a modified silicone resin and a catalyst for the resin, curable at normal temperature in spite of one-pack type composition, having excellent storage stability and giving a cured material having excellent elasticity. CONSTITUTION:The adhesive contains (A) an epoxy resin, (B) a ketimine of formula (R1 to R4 are H, 1-6C alkyl, etc.; X1 and X2 are 2-6C alkylene; m is 0-1) wherein the imino group in the skeleton is reacted with at least one kind of compound selected from styrene oxide, butyl glycidyl ether, allyl glycidyl ether, p-tert- or p-sec-butylphenyl glycidyl ether, m,p- or p-cresyl glycidyl ether, vinylcyclohexane dioxide, versatic acid glycidyl ester, cardanol-modified glycidyl ether, dimer acid glycidyl ester, etc., (C) a modified silicone resin and (D) a catalyst for the component C.