JPH05299826

PURPOSE:To provide a method for soldering the leads of a component surface mounted on a printed wiring board to jumper wires in which soldering work is facilitated while enhancing reliability with no possibility of short circuit between adjacent pads or between an adjacent lead and a pad. CONSTITUTI...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TOMINAGA JUNJI, SAKAI MIYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a method for soldering the leads of a component surface mounted on a printed wiring board to jumper wires in which soldering work is facilitated while enhancing reliability with no possibility of short circuit between adjacent pads or between an adjacent lead and a pad. CONSTITUTION:A planar jig 20 having a hole 25 corresponding to a bonding seat 11A for a selected lead 11 and covering the surface of bonding seat 11A for another lead 11 adjacent to the selected lead 11 is set on a printed wiring board 1. A jumper wire 5 is then soldered, at the end thereof, to the bonding seat 11A for the selected lead 11 by means of a soldering iron 6.