JPH05293763

PURPOSE:To simplify a manufacturing process, to improve productivity, and to increase the fixing force of a grinding grain layer by fixing a grinding grain layer to a base metal simultaneously with formation of the grinding grain layer through pressure heating molding after a mold is filled with the original grains of the grinding grain layer in a state to make contact with the plated layer of the base metal. CONSTITUTION:A base metal on the surface of which a plated layer is formed is incorporated in a mold. The mold is filled with the original grains of a grinding grain layer containing resin and metallic powder in a state to make contact with the plated layer. Thereafter, simultaneously with formation of a plated layer through pressure heating molding, the plated layer is fixed to the base metal to produce a desired resin bond wheel. In this case, the base metal is made of a metal and the plated layer is a copper-plated layer with a thickness of 5-60mum.