JPH05291752

PURPOSE:To prevent the warp at baking of a multilayer circuit board made of glass ceramic where a thick circuit is made on the surface of one side. CONSTITUTION:In a multilayer circuit board 1 made of glass ceramic where a conductor pattern 2 and an insulating glass pattern 3 are made by printing an...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKAHARA MASAHARU, SUGITA YUTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent the warp at baking of a multilayer circuit board made of glass ceramic where a thick circuit is made on the surface of one side. CONSTITUTION:In a multilayer circuit board 1 made of glass ceramic where a conductor pattern 2 and an insulating glass pattern 3 are made by printing and baking a thick films on the thick film circuit formation faces 4 on one side, at least one layer of insulating glass pattern 3 or at least one layer of conductor pattern 2 is printed and backed on the dummy pattern formation face 5 on the other surface.