JPH05291159

PURPOSE:To provide a semiconductor manufacturing device having the intensified stability during the wafer processing step by avoiding the loosening by temperature fluctuation in the connection part of a relay terminal connecting a heater terminal of a diffusion furnace to a power supply cable termin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	TAKAHASHI HIROSHIGE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CURRENT COLLECTORS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNACES FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL HEATING KILNS LIGHTING LINE CONNECTORS MECHANICAL ENGINEERING OPEN SINTERING OR LIKE APPARATUS OVENS RETORTS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a semiconductor manufacturing device having the intensified stability during the wafer processing step by avoiding the loosening by temperature fluctuation in the connection part of a relay terminal connecting a heater terminal of a diffusion furnace to a power supply cable terminal. CONSTITUTION:A heater terminal 20, a power supply cable terminal 30 and a relay terminal 10 of a diffusion furnace heater of the semiconductor manufacturing device are formed using the same thermal expansion coefficient kanthal so that the loosening of respective connecting parts of the heater terminal 20 and the power-supply cable terminal 30 connected by a bolt 4, a nut 5, another bolt 6 and another nut 7 may be avoided.