JPH05287478

PURPOSE:To decrease the fluctuation in plating deposition by correcting the shape of a strip in a wiping nozzle part in the subject production and apparatus. CONSTITUTION:The warpage in the transverse direction of the strip 1 near the wiping nozzles 7 is detected and the positions of support rolls 6...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	IMAIZUMI HIDEHIKO, NAMIENO TSUTOMU, KIMURA YOSHITAKA, OKAWA AKIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To decrease the fluctuation in plating deposition by correcting the shape of a strip in a wiping nozzle part in the subject production and apparatus. CONSTITUTION:The warpage in the transverse direction of the strip 1 near the wiping nozzles 7 is detected and the positions of support rolls 6 and a pot roll 5 are adjusted from the data on this warpage in the hot dip metal coating line which adjusts the plating deposition by blowing wiping gases to the strip 1 past the hot dip metal coating bath. The shape of the strip is then corrected to a flat shape and the uniform plating deposition is obtd. by automatic control. The shape of the strip is roughly adjusted by adjusting the positions of the support rolls 6 and the shape of the strip is finely adjusted by adjusting the position of the pot roll 5.