JPH05251453

PURPOSE:To improve bonding quality by applying pressure to an ultra-fine particle grinding wheel of which grinding surface is formed flat while giving thereto the lateral vibration of ultrasonic wave and giving a fine cutting area to a stud bump formed on an IC chip electrode part and then grinding such cutting area. CONSTITUTION:At the lower surface of a rectangular main body 1, a grinding surface 10 is formed flat by coating the surface with ultra-fine particle grinding material 2 using a particle binding agent. While the lateral vibration is given with the ultrasonic wave to the main body, pressure is also applied toward the lower direction. Thereby a fine cutting area is formed to a stud bump 4 formed at the rear surface of an IC chip 3 placed on the working desk 7 and this area is ground. Thereby, the height of the stud bump can easily be made uniform.