JPH05247383

PURPOSE:To provide an inexpensive electrically conductive coating highly excellent in electrical conduction stability even in high-temperature, high-humidity states, thus applicable to electronic equipment and electronic application equipment, chiefly comprising a water-based resin emulsion, copper and copper alloy powder, and an aliphatic amine. CONSTITUTION:(A) An aqueous solution of a nonionic surfactant such as polyoxyethylene nonylphenyl ether is added to an acrylic emulsion comprising chiefly an acrylic ester and methacrylic ester followed by homogeneous agitation to prepare a water-based resin emulsion. This emulsion is then incorporated with (B) copper powder such as electrolytic copper powder and/or copper alloy powder and (C) a butyl cellosolve with an aliphatic amine such as stearylamine dissolved therein, followed by agitation, and the resulting emulsion is incorporated with (1) a phosphonic acid compound such as aminotrimetylenephosphonic acid and (2) a titanate coupling agent such as isopropyltriisostearoyl titanate, thus affording the objective electrically conductive coating with improved electrical conduction stability.