JPH05245624

PURPOSE:To provide a solder reflowing device by which a good soldering is performed regardless of dimension and heat capacity of the device. CONSTITUTION:In the solder reflowing device provided with a preheating zone 3, reflowing temperature rising zone 4, reflowing zone 5, which are dividedly arran...

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Bibliographische Detailangaben
1. Verfasser:	TAKEI TOSHIYASU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a solder reflowing device by which a good soldering is performed regardless of dimension and heat capacity of the device. CONSTITUTION:In the solder reflowing device provided with a preheating zone 3, reflowing temperature rising zone 4, reflowing zone 5, which are dividedly arranged in order to heat a printed wiring board temporarily attached with surface mounting parts, and a conveyor by which the printed wiring boards are successively transported to each zone; in a section from the reflowing temperature rising zone 4 to the reflowing zone 5, a local heating means 6 is provided by which the local surface of the printed wiring board 7 is heated while being moved in parallel with the conveyor 2.