JPH05243442

PURPOSE:To eliminate a solder connecting malfunction and to delete the steps of checking the appearance and correcting the soldering after mounting the diode by forming an anode terminal and a cathode terminal along surfaces of a package at least on four surfaces of the package. CONSTITUTION:A cathode terminal 3a is led to a second surface side of epoxy resin 1, an anode terminal 4 is led to a fourth surface side, and respectively bent along the second and fourth surfaces. An anode terminal 4b and a cathode terminal 3b are led to a third surface side, and bent along the third surface. Similarly, an anode terminal 4c and a cathode terminal 3c are formed on a fifth surface side. Thus, on the second, third, fourth and fifth surfaces, the anode or cathode terminal and the anode and cathode terminals are formed. In this manner, at the time of mounting the diode on a printed board, any of the anode and cathode terminals is soldered to the board. Thus, soldering defect is eliminated, the steps of checking and correcting an external appearance after mounting can be deleted, and a decrease in a quality due to improper soldering can be obviated.