JPH05239189

PURPOSE:To obtain the subject molding material, comprising thiobis(methyl-t- butylphenol), excellent in reliability of withstand voltage in moisture and useful as electrical and electronic parts, etc. CONSTITUTION:The objective molding material is obtained by including (B) 1-30 pts.wt. 4,4-thiobis(3...

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Bibliographische Detailangaben
Hauptverfasser:	MIYATANI YOSHIHIRO, IKEDA KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS RESISTORS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain the subject molding material, comprising thiobis(methyl-t- butylphenol), excellent in reliability of withstand voltage in moisture and useful as electrical and electronic parts, etc. CONSTITUTION:The objective molding material is obtained by including (B) 1-30 pts.wt. 4,4-thiobis(3-methyl-6-t-butylphenol) in (A) 100 pts.wt. resin such as bisphenol A type epoxy resin.